System and Method for Passive Thermal Control of an Information Handling System Enclosure

ABSTRACT

An information technology enclosure has a processing subsystem and infrastructure subsystem in separate shipping containers that cooperate to process information. The processing subsystem has increased information processing density by concentrating information handling systems in a first processing shipping container that is supported with infrastructure equipment in a second infrastructure shipping container. In one embodiment, the shipping containers are arranged in a stacked configuration so that cooled air and exhausted air are exchanged through aligned vents formed in the ceiling and floor of stacked shipping containers.

CROSS REFERENCE TO RELATED APPLICATIONS

U.S. patent application Ser. No. ______, entitled “System and Method forVertically Stacked Information Handling System and InfrastructureEnclosures,” inventors Ty Schmitt and Robert Riegler, Attorney DocketNo. DC-15099, filed on ______, describes exemplary methods and systemsand is incorporated by reference in its entirety.

U.S. patent application Ser. No. ______, entitled “System and Method forVertically Stacked Information Handling System and InfrastructureEnclosures,” inventors Ty Schmitt and Robert Riegler, Attorney DocketNo. DC-15100, filed on ______, describes exemplary methods and systemsand is incorporated by reference in its entirety.

U.S. patent application Ser. No. ______, entitled “System and Method forVertically Stacked Information Handling System and InfrastructureEnclosures,” inventors Ty Schmitt and Robert Riegler, Attorney DocketNo. DC-15156, filed on ______, describes exemplary methods and systemsand is incorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates in general to the field of informationhandling system manufacture, use, and distribution, and moreparticularly to a system and method for configuration of informationhandling systems as mobile information technology systems.

2. Description of the Related Art

As the value and use of information continues to increase, individualsand businesses seek additional ways to process and store information.One option available to users is information handling systems. Aninformation handling system generally processes, compiles, stores,and/or communicates information or data for business, personal, or otherpurposes thereby allowing users to take advantage of the value of theinformation. Because technology and information handling needs andrequirements vary between different users or applications, informationhandling systems may also vary regarding what information is handled,how the information is handled, how much information is processed,stored, or communicated, and how quickly and efficiently the informationmay be processed, stored, or communicated. The variations in informationhandling systems allow for information handling systems to be general orconfigured for a specific user or specific use such as financialtransaction processing, airline reservations, enterprise data storage,or global communications. In addition, information handling systems mayinclude a variety of hardware and software components that may beconfigured to process, store, and communicate information and mayinclude one or more computer systems, data storage systems, andnetworking systems.

Increases in the capabilities of information handling systems andnetworking technologies has led to an increasing reliance by businessesand other enterprises on information handling systems to perform avariety of tasks. Often, information handling system servers are placedin a building or room that has specialized power and cooling equipmentto help ensure a compatible environment for the systems. As examples ofspecialized power needs, a concentration of information handling systemsoften consume a considerable amount of power, typically require a steadyand reliable power supply and typically have backup power sources in theevent that a main power source is interrupted. As examples ofspecialized cooling needs, a concentration of information handlingsystems often produces a considerable amount of heat as a byproduct oftheir operation and typically has dedicated cooling systems to removethe heat. Often, enterprise information technology specialists employ anover-kill approach when purchasing and installing infrastructure for aninformation handling system data center. For example, cooling systemstypically are purchased and installed that have excess cooling capacityto provide a margin of error. Extra cooling capacity also providesinfrastructure to accommodate growth in the number of systems that itsupports. Similarly, information handling system data center rooms areoften built with unused space so that additional information handlingsystems may be added over time. Typically, as enterprise informationhandling system needs grow, enterprises add and replace existingsystems; thus, maneuvering room is generally needed within a data centerroom to service existing systems of the data center. Data centers faceconsiderable infrastructure costs if existing cooling, power and spacein a data center become inadequate to handle enterprise informationprocessing needs.

A recent industry trend seeks to simplify the set up and operation of adata center by installing all or most of the elements of the data centerin one or more mobile modules, such as shipping containers. Two examplesof such systems are the BLACK BOX manufactured by SUN MICROSYSTEMS andthe ICE CUBE manufactured by RACKABLE SYSTEMS. Information handlingsystems are installed in a shipping container along with cooling, powerand networking infrastructure. The shipping containers conform tostandards designed for shipping freight through intermodaltransportation infrastructure, such as ISO standards. For example, atypical shipping container has a length of forty feet, a width of eightfeet and a height of nine feet and six inches. Five common ISO standardshipping container lengths are twenty, forty, forty-five, forty-eightand fifty-three feet, although a variety of other sizes may also beused. The shipping container is shipped as normal freight so that, whenthe shipping container arrives at its destination, the informationhandling systems are ready to operate within the container. Althoughshipping container solutions provide the enterprise with improvedflexibility in setting up a data center building by essentiallyproviding the building, i.e., the shipping container, with theinformation handling systems, existing shipping container solutionscontinue to share the problems faced by conventional data centers withrespect to power consumption and cooling. One type of shipping containersolution attempts to include cooling, power and networkinginfrastructure with the information handling systems in a commonshipping container. Such solutions face difficulty in manufacture due tothe variety of different types of components that are assembled, anddifficulty in deployment since a module generally must include coolingresources for a variety of different climates. U.S. Pat. No. 7,278,273describes cooling modules that are shipping containers having HVACequipment and that are separate from a shipping container that hasinformation handling systems; however, air movers for moving cold airare included with the information handling system shipping container,with each air mover providing air to an isolated portion of informationhandling systems. The addition of the air movers with the informationhandling systems tends to reduce the space available for informationhandling systems and to increase the complexity of assembly of theshipping module.

SUMMARY OF THE INVENTION

Therefore a need has arisen for a system and method which configuresmobile information technology systems to provide greater computingdensity with more efficient infrastructure resource allocation.

In accordance with the present invention, a system and method areprovided which substantially reduce the disadvantages and problemsassociated with previous methods and systems for mobile informationtechnology systems. An information technology enclosure is built with aprocessing subsystem housed in a first shipping container and aninfrastructure subsystem housed in a second shipping container. Theprocessing subsystem has a high density of information handling systemssupported in the first shipping container by distributing infrastructureequipment to the second shipping container. The information technologyenclosure operates in the shipping containers in which the processingsubsystem and infrastructure subsystem are built and shipped with theenvironment of the processing subsystem maintained by passive and activethermal management of the infrastructure subsystem.

More specifically, an information technology enclosure ships in shippingcontainers that are subsequently used to house a processing subsystem toprocess information and an infrastructure subsystem to support operationof the processing subsystem. The processing subsystem concentratesprocessing equipment in a first shipping container, such as by arrangingracks in one or more rows that define intake portions and exhaustportions. Information handling systems are disposed in the racks toaccept cooling airflow from the intake portion and to exhaust theairflow to the exhaust portion. The infrastructure subsystem includesone or more air movers in a second shipping container that outputtreated air to the intake portion of the first shipping container andreceive exhaust from the exhaust portion of the first shippingcontainer. For example, the first and second shipping containers stackin a vertical configuration to align vent openings that allow airflowbetween the air movers and the processing subsystem. The air moverssupport active thermal management with a coil that receives chilledwater from a source external to the shipping containers with the airmover pressurization, airflow temperature and coil temperature managedby an environment controller. Under some circumstances, the environmentcontroller uses passive thermal management, such as by actuating ventsto allow external air into the shipping containers and/or to exhaust airfrom the shipping containers. Thermal management supported by theinfrastructure subsystem, such as the size and capacity of the air moverand coils or the redundancy of the thermal transfer equipment, isbuilt-to-order to support the information handling systems within theprocessing subsystem. The information handling systems arebuilt-to-order to perform a common processing task, such as a searchengine function or a data storage function.

The present invention provides a number of important technicaladvantages. One example of an important technical advantage is that aprocessing subsystem concentrates information handling systems in ashipping container for improved processing density while aninfrastructure subsystem supports operation of the information handlingsystems with an efficient allocation of infrastructure equipment.Stacked configuration of the processing subsystem and infrastructuresubsystem provides a convenient arrangement for communicating treatedair to the information handling systems with a minimal footprint. Theinfrastructure subsystem shipping container treats air for use by theprocessing subsystem with active thermal management, such as by blowingair past, over or through a coil having chilled water supplied by anexternal source, or with passive thermal management, such as byactuating vents for receiving external air into or exhausting internalair from the processing or infrastructure subsystems, or by enabling anenthalpy wheel to aid in removal of heat from exhaust air within theprocessing or infrastructure subsystems. Information handling systemracks are arranged in rows that define intake and exhaust portions ofthe processing subsystem to help force air through information handlingsystems.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention may be better understood, and its numerousobjects, features and advantages made apparent to those skilled in theart by referencing the accompanying drawings. The use of the samereference number throughout the several figures designates a like orsimilar element.

FIG. 1 depicts a perspective cutaway view of an information technologyenclosure having processing subsystem and an infrastructure subsystemthat incorporates air movers and modulated vents for closed loop coolingor air side economization;

FIGS. 2A and 2B depict perspective cutaway views of an informationtechnology enclosure having increased information handling systemdensity;

FIG. 3 depicts a perspective cutaway view of an information technologyenclosure having an infrastructure subsystem at each end of a processingsubsystem to provide thermal transfer and power infrastructure;

FIG. 4 depicts a perspective cutaway view of an information technologyenclosure having a processing subsystem stacked over top of aninfrastructure subsystem that provides thermal transfer and powerinfrastructure;

FIGS. 5A through 5C depict an infrastructure subsystem having pluralbuilt-to-order configurations that a data center can order customized toan intended operating environment;

FIGS. 6A through 6D depict a processing subsystem or infrastructuresubsystem having enthalpy wheels to assist thermal transfer of heat fromwithin a shipping container to outside the shipping container;

FIG. 7 depicts a block diagram of an environment controller that appliesinformation from multiple sensors to control the environment within aprocessing subsystem;

FIG. 8 depicts a front perspective view of an information technologyenclosure; and

FIG. 8A depicts information handling systems in a rack with supply andexhaust air.

DETAILED DESCRIPTION

An information technology enclosure has plural information handlingsystems disposed in a processing subsystem shipping container and airmover and coil assemblies in an infrastructure container to provide amobile, high-density data center. For purposes of this disclosure, aninformation handling system may include any instrumentality or aggregateof instrumentalities operable to compute, classify, process, transmit,receive, retrieve, originate, switch, store, display, manifest, detect,record, reproduce, handle, or utilize any form of information,intelligence, or data for business, scientific, control, or otherpurposes. For example, an information handling system may be a personalcomputer, a network storage device, or any other suitable device and mayvary in size, shape, performance, functionality, and price. Theinformation handling system may include random access memory (RAM), oneor more processing resources such as a central processing unit (CPU) orhardware or software control logic, ROM, and/or other types ofnonvolatile memory. Additional components of the information handlingsystem may include one or more disk drives, one or more network portsfor communicating with external devices as well as various input andoutput (I/O) devices, such as a keyboard, a mouse, and a video display.The information handling system may also include one or more busesoperable to transmit communications between the various hardwarecomponents.

Referring now to FIG. 1, a perspective cutaway view depicts aninformation technology enclosure 10 having a processing subsystem 11 andan infrastructure subsystem 12 that incorporates air movers 13 andmodulated vents 14 for closed loop cooling or air side economization.Air movers 13 may be any of plural types of air movers, such as directaxial, plenum of impellor movers. Processing subsystem 11 has aplurality of information handling system racks 16 disposed in a row 18within a shipping container 20. Shipping container 20 is built for usein a transportation infrastructure, such as with dimensions that fit ona semi-tractor trailer truck or a railroad car so that the shippingcontainer 20 is delivered to an operating location to allow informationhandling systems 22 to operate within shipping container 20. Processingsubsystem 11 ships with information handling systems 22 assembled inracks 16 and ready for operation when delivered to an end destination.Infrastructure subsystem 12 ships in a separate shipping container 20from processing subsystem 11 or, alternatively, ships in a commonshipping container with processing subsystem 11, although the shippingcontainers for processing subsystem 11 and infrastructure subsystem 12may be of different sizes. In the example embodiment depicted by FIG. 1,racks 16 are blade chassis that hold plural blade information handlingsystems. Alternatively, racks 16 are standard sized data center racksthat hold plural information handling systems 22. Although the presentexample embodiment depicts that a shipping container is used to containprocessing subsystem 11 and infrastructure subsystem 12, in alternativeembodiments alternative transportable enclosures might be used tocontain a processing subsystem 11 and an infrastructure subsystem 12.Transportable enclosures include any type of structure that might beused to move contents, such as a structure that is moveable on a flatbed truck or railroad car, and then to contain the contents in anoperational state at an end location. Such purpose built portablestructures allow assembly of a processing subsystem 11 or infrastructuresubsystem 12 within the structure at an assembly manufacture location,shipment of the structure to an end user location site, and operationwithin the structure at the end user location site without anysubstantial alterations made to the equipment held by the structure.

Row 18 divides shipping container 20 into two portions, an air intakeportion 24 and an air exhaust portion 26, which are isolated from eachother. For example, racks 16 extend from the floor to the ceiling ofshipping container 20 so that air within air intake portion 24 travelsto exhaust portion 26 substantially only through information handlingsystems 22. Infrastructure subsystem 12 couples to processing subsystem11 at one end of shipping container 20 so that air movers 13 are alignedto blow air into intake portion 24 and receive air from exhaust portion26. Air movers 13 move air to create an overpressure condition withinair intake portion 24 to force cooling airflow through informationhandling systems 22 and into exhaust portion 26. The cooling airflow maybe assisted by cooling fans operating within information handlingsystems 22, or information handling systems 22 may rely on theoverpressure without the use of internal cooling fans, which may beselectively shut off to conserve power when overpressure cooling isadequate to maintain a desired thermal state, or which may simply not bepresent within information handling systems 22. Air moved frominfrastructure subsystem 12 into air intake portion 24 passes across acoil assembly 32, which heats or cools the air as needed to maintainoperation of information handling systems 22 at a desired operatingtemperature. Coil assembly 32 receives chilled (or heated) water from acooling fluid interface 28 which couples to an external chilled watersupply. In alternative embodiments, the cooling fluid may be chilledwater, tap water, glycol, refrigerant, evaporative or other types ofcooling fluids with various cooling techniques used alone or incombination to treat air provided to air intake portion 24. Theoverpressure in air intake portion 24 forces the cooled or heated airthrough information handling systems 22 and into air exhaust portion 26.As the air passes through information handling systems 22, thermaltransfer brings the information handling systems to a temperature closerto that of the air. In one embodiment, motors attached to variablefrequency drives or voltage output devices drive and regulate air moversand valves to control cooling fluid by adjusting valve positions in acombined coil and air mover assembly also referred to as an air handler.For example a coil and air mover assembly includes coils, air movers,motors, valves, control boards, variable frequency drives, sensors,humidity adders, controllable louvers/dampers and power, cooling fluid,and air signal inputs and outputs.

In operation, information technology enclosure 10 is shipped to alocation having power, networking and HVAC resources. Informationtechnology enclosure 10 is shipped with processing subsystem 11 andinfrastructure subsystem 12 in a common shipping container or inseparate shipping containers that are assembled at the end location.Power is applied to information handling systems 22, network resourcesare interfaced with information handling systems 22 and chilled orheated water is interfaced with coil assembly 32. An environmentcontroller, discussed in greater detail in FIG. 7, monitors thermalconditions within processing subsystem 11 to maintain desired thermalconstraints for operation of information handling systems 22. In somecircumstances, thermal constraints are maintained with a closed loopthermal scheme that transports air internally between air intake portion24 and air exhaust portion 26 with cooling or heating as needed by coilassembly 32. For example, a closed loop thermal scheme is used whereconditions external to shipping container 20 are unfriendly to theoperation of information handling systems 22, such as an externalenvironment with a high ambient temperature. Alternatively aireconomization modifies the closed loop thermal scheme where externalconditions are favorable to information handling systems 22, such aswhere the external environment ambient temperature is low. Modulatedexhaust vents 14 and modulated inlet vents 30 open to varying degrees sothat airflow passes from inlet vent 30 through information handlingsystems 22 and out exhaust vents 14. Vents 14 and 30 may operateindependently and open to varying degrees based on ambient conditions tomaintain temperatures of information handling systems 22 in a desiredrange. In ambient temperatures having extreme cold, vents 14 and 30 canremain shut so that heat released by information handling systems 22recycles to maintain a minimum temperature within processing subsystem11. In one embodiment, exhaust air and exterior air are mixed by openingexhaust vents and inlet vents to varying degrees so that the temperatureof air in air intake portion 24 is regulated by the mixing. Modulatedexhaust vents 14 actuate independently to help control airflow betweeninformation handling systems 22. For example, an exhaust vent 34 opensto a greater degree where the exhaust vent 34 is proximate aninformation handling system 22 having an elevated temperature so that agreater flow of cooling air passes through the information handlingsystem 22 having the elevated temperature.

Referring now to FIGS. 2A and 2B, a perspective cutaway view depicts aninformation technology enclosure 10 processing subsystem 11 havingincreased information handling system 22 density. By moving supportinginfrastructure, such as power and air moving equipment, outside of theshipping container 20 of processing subsystem 11, all of the room withinshipping container 20 is available for use by information handlingsystems 22 and racks 16, thus allowing an increased density ofinformation handling systems 22. Air blowing of chilled or heated air isprovided from a location external to the shipping container 20 ofprocessing subsystem 11. For example, a second shipping container 20that contains supporting infrastructure in an infrastructure subsystem12 may be placed over top or underneath processing subsystem 11 so thatair movers in the infrastructure subsystem provide air flow throughopenings formed in the shipping containers 20 that align when assembled.Alternatively, an infrastructure subsystem provides supportinginfrastructure by placement along one or more of the sides 36 or ends 38of shipping container 20 of processing subsystem 11. FIG. 2A depictsinformation handling system racks 16 aligned in two rows 18 that runfrom end 38 to opposing end 38 of shipping container 20 parallel withsides 36 running the length of shipping container 20. The area definedin shipping container 20 between rows 18 form an intake portion 24 intowhich an infrastructure subsystem 12 blows cooling air that travelsthrough information handling systems 22 and into an exhaust portion 26along each side 36 of shipping container 20. In an alternativeembodiment, the area between rows 18 define an exhaust portion whilecooling airflow is blown along sides 36 of shipping container 20 to flowthrough information handling systems 22 and into the central portion ofshipping container 20. FIG. 2B depicts information handling system racks16 aligned in plural rows 18 that run from side 36 to opposing side 36of shipping container 20 perpendicular to the length of shippingcontainer 20. Intake portions 24 are formed between rows 18 by havinginformation handling systems 22 of opposing rows 18 face intake ventstowards each other. Exhaust portions 26 are formed between rows 18 byhaving information handling systems 22 of opposing rows face exhaustvents towards each other. An infrastructure subsystem provides coolingairflow to intake portions 24 with vents formed in the floor, ceiling orsides of shipping container 20 adjacent intake portions 24, and receivesexhaust with vents adjacent exhaust portions 26. To facilitate access toinformation handling systems 22, all or portions of sides 36 and ends 38of the embodiments of FIGS. 2A and 2B are removable. Additionally, sides36 and ends 38 may have vents to an external environment formed to aidthermal transfer or air side economization as described with respect toFIG. 1. For example, side vents formed along rows 18 of FIG. 2A allowair to enter through sides 36, pass through information handling systems22 and exit through the center of rows 18 with a vent in end 38 orthrough the ceiling or floor of shipping container 20. Increasingdensity of information handling systems 22 in a shipping container 20provides a cost effective solution for enterprises that have existingpower and thermal transfer resources already available for theinformation handling systems 22.

Referring now to FIG. 3, a perspective cutaway view depicts aninformation technology enclosure 10 having dual infrastructuresubsystems 12 at each end 38 of processing subsystem 11 to providethermal transfer and power infrastructure. Information technologyenclosure 10 has increased information handling system 22 density withina shipping container 20 by distributing thermal transfer and powerinfrastructure to a shipping container 20 or other location external tothe shipping container 20 that contains information handling systems 22.In the example embodiment depicted by FIG. 3, air movers 13 blows airthrough coil assembly 32 to push treated air into processing subsystem11. Coil assembly 32 interfaces with an external HVAC system to receivechilled or heated water through a chilled water interface 28. A powersubsystem 42 includes power infrastructure to support operation of theinformation handling systems 22, such as a transformer, anuninterruptible power supply (UPS) and battery for backup power and apower distribution unit (PDU). Switching gear 44 interfaces networkconnections for the information handling systems 22 with externalnetworks, such as the Internet or an enterprise intranet. Openings 39formed in the ends 38 of the shipping containers 20 that holdinfrastructure subsystem 12 and processing subsystem 11 align to allowconnections to support power and thermal infrastructure provisioning toinformation handling systems 22. Modulated exhaust vents 14 formed inthe ceiling of shipping container 20 support air side economizationwhere ambient conditions allow. In operation, each shipping container 20of information technology enclosure 10 is manufactured to includeinformation handling systems, power or thermal transfer components andthen shipped via conventional transportation to a desired location, suchas by rail or truck. Once at the desired location, informationtechnology enclosure 10 having one or more processing subsystems 11 andone or more infrastructure subsystems 12 are unloaded in alignedpositions to connect power and thermal transfer infrastructure resourceswith information handling systems 22. End-to-end configurations such asthat depicted by FIG. 3 are convenient for unloading where adequatespace is available for the modules. Limitations in available space maybe addressed with the stacked configurations described herein.

Referring now to FIG. 4, a perspective cutaway view depicts aninformation technology enclosure 10 having a processing subsystem 11 ina full height shipping container 20 stacked over top of aninfrastructure subsystem 12 in a half-height shipping container 20.Infrastructure subsystem 12 provides thermal transfer and powerinfrastructure to processing subsystem 11. Stacking processing subsystem11 over the top of infrastructure subsystem 12 reduces the overallfootprint of the assembled information technology enclosure 10 relativeto the end-to-end configuration depicted in FIG. 3. The stackedconfiguration also provides convenient alignment of openings formed inthe upper surface ceiling of infrastructure subsystem 12 and the lowersurface floor of processing subsystem 11. Infrastructure subsystem 12upper vent 48 allows air pushed by air mover and coil assemblies 40 toenter at a lower surface of processing subsystem 11 similar to themanner used by plenums in conventional data centers. When using air sideeconomization, external air provided through infrastructure subsystem 12upper vent 48 moves through information handling systems 22 and outupper exhaust vents 46 formed in the ceiling of processing subsystem 11.Although FIG. 4 depicts processing subsystem 11 stacked overinfrastructure subsystem 12, in alternative embodiments, infrastructuresubsystem 12 may stack over top of processing subsystem 11 and plurallayers of infrastructure and processing subsystems may be stacked overeach other.

The stacked configuration depicted by FIG. 4 allows very high densitylevels of information handling systems 22 in a shipping container 20 byconcentrating information handling systems in one shipping container 20while providing support infrastructure in a separate shipping container20, such as air mover and coil assembly 40, switching gear 44 and powersubsystems. For example, in one embodiment, information technologyenclosure 10 includes substantially only racks 16 of informationhandling systems 22 in a processing subsystem 11 while infrastructuresubsystem 12 includes supporting components such as air mover and coilassembly 40, switchgear 44, and a power subsystem 42 having powerdistribution units, transformers, UPS and battery banks. Further, accessremains available to the interiors of the shipping containers 20 throughremoval of either side or end portions. Thermal transfer for theinformation technology enclosure 10 may be performed with closed loopoperation or air economization as set forth herein. In alternativeembodiments, the stacked configuration may be accomplished withinfrastructure subsystems 12 placed over the top of processingsubsystems 11 and a data center built with shipping containers 20 maystack plural layers of either infrastructure subsystems 12 processingsubsystems 11 over top of each other interspersed a variety of orders.

Referring now to FIGS. 5A through 5D, infrastructure subsystems 12 aredepicted having plural built-to-order configurations that a data centerorders customized to an intended operating environment. For example,based upon the external environment in which it will operate, a datacenter selects whether to build a supporting module 40 with or withoutfilters to filter air accepted at vents, single or multiple heatexchanger coils that add or remove thermal energy from airflow providedby air movers, single or multiple coil assemblies to treat airflowprovided by air movers, solid or vented shipping container panels andactuated or non-actuated vents. The build-to-order approach forconfiguring infrastructure subsystems provides data centers withflexibility to scale out their infrastructure over time, such as toadapt as the characteristics of the data center change over time withthe addition or replacement of information handling systems. Further,data centers may build-to-order infrastructure subsystems 12 andprocessing subsystems 11 designed to address specific informationprocessing tasks, such as search engines or data storage. Manufacture ofinfrastructure subsystems 12 around a common design having differentpopulations of thermal transfer and power components improvesmanufacture efficiency and data center continuity over time, such as byallowing existing thermal transfer and power components to adjust toprocessing subsystems 11 over time. Further, end users can populate aninfrastructure subsystem 12 to provide a desired level of redundancy forpower and thermal transfer functions.

FIG. 5A depicts an upper perspective view of an infrastructure subsystem12 manufactured in a shipping container 20. Actuated vents 50 located onthe upper side panels of shipping container 20 selectively open andclose for access to outside air, such as to support air sideeconomization. Upper vents 46 interact with a processing subsystem 11placed over top of infrastructure subsystem 12 to draw air from theprocessing subsystem and force air back into the processing subsystem tocool information handling systems. A connection panel 52 providescentrally-located connectors for power, chilled water, network andcontrol connections. A status panel 54 outputs information regarding thestatus of equipment within infrastructure subsystem 12. FIG. 5B depictsan upper perspective view of an infrastructure subsystem 12 with a sidepanel of shipping container 20 removed for access to infrastructureequipment. Coil assemblies 32 accept chilled water from an externalsource, such as an external HVAC system. Airflow, represented by arrows58, is received from an upper vent to pass through coils 32 where theairflow is cooled before being directed back upwards to a processingsubsystem 11 to cool information handling systems. In alternativeembodiments, coils 32 accept heated water to provide thermal energywhere the operating temperatures are too low for information handlingsystems. Further, coils 32 might include an evaporator to remove or addmoisture to airflow 58. Access doors 60 allow access for maintenancework to equipment within supporting module 40. FIG. 5C depicts a topcutaway view of an infrastructure subsystem 12 that rests over the topof a processing subsystem 11. Air movers 13 draw air into infrastructuresubsystem 12 from vents located at the floor of shipping container 20and push airflow 58 through coil assemblies 32 and back down into theprocessing subsystem through vents 46. Disposing cooling coils in avertical configuration along the length of supporting module 40 providesincreased surface area for thermal transfer of energy from airflow 58.Back-up power UPS units 62 provide power for a limited time period inthe event that power to a mobile information handling system module iscutoff. A cooling fluid line 64 accepts a cooling fluid, such as chilledor heated water, tap water, refrigerants glycol or other types offluids, from a source external to shipping container 20 for distributionthrough coil assemblies 32.

Referring now to FIGS. 6A through 6D, a information technologyenclosures 10 are depicted having enthalpy wheels 64 to assist thermaltransfer from within a shipping container 20 to outside the shippingcontainer 20, such from a processing subsystem 11 or an infrastructuresubsystem 12. One source of significant energy consumption for datacenters under most environmental conditions is energy for removing heatfrom information handling systems during normal operations. Typical datacenters use dedicated HVAC equipment to cool the air provided to theinformation handling systems so that sufficient heat is removed from theinformation handling systems. Enthalpy wheel 64 helps to reduce energyconsumption for cooling airflow to information handling systems bypassively absorbing heat from within an information technology enclosure10 for release to the outside environment. Enthalpy wheels takeadvantage of external temperatures that are cooler than internaltemperatures by transferring heat with the wheel material whilemaintaining external and internal air separate from each other to avoidcontamination or foreign material intrusion. In addition to reducingenergy consumption for removing heat, enthalpy wheel 64 reduces theequipment requirements for cooling a given information technologyenclosure, thus reducing the overall cost of setting up the informationtechnology enclosure. Air movers push or pull air across the enthalpywheel to aid heat transfer while a small motor causes the wheel to turn.Enthalpy wheel movement may be aided my internal air movement and, in awindy environment, external wind may cause the enthalpy wheel to turn.When within shipping container 20, enthalpy wheel blades 66 absorb heat.As the enthalpy wheel 64 turns to place the blade 66 into the externalenvironment, the blade 66 releases heat. Enthalpy wheels 64 may be usedalone, with air movers and with HVAC equipment, depending upon theexternal environment.

FIG. 6A depicts a side cut away view of a processing subsystem 11 havingplural information handling systems 22 operating in racks 16 within ashipping container 20. Enthalpy wheels 64 are disposed within processingsubsystem 11 so that approximately one-half of each enthalpy wheel 64 isexposed to the external environment and one-half is exposed to theenvironment within shipping container 20. As enthalpy wheel 64 turns,blades 66 absorb thermal energy from within shipping container 20 andthen rotate to release thermal energy to the external environment. Theexample embodiment of FIG. 6A has enthalpy wheels 64 oriented in avertical configuration relative to shipping container 20. Blades 66 turndue to a motor located outside the shipping container and, in someinstances, by airflow within shipping container 20, such as airflowcreated by cooling fan exhaust or air movers. FIG. 6B depicts enthalpywheels 64 disposed in a horizontal configuration relative to shippingcontainer 20. Enthalpy wheels 64 may be incorporated in eitherprocessing subsystem 11 or infrastructure subsystem 12. For example,enthalpy wheel 64 rotates within the portion of an infrastructuresubsystem that accepts air from the exhaust portion of a processingsubsystem. The cut away view of FIG. 6C depicts an airflow 58 generatedby air movers that passes either cooled air or external air throughinformation handling systems 22. Airflow 58 is, for instance, directedacross blades 66 of enthalpy wheels 64 and then routed to pass bycooling coils for recycling through information handling systems 22.Removal of part of the heat from the airflow by enthalpy wheels 64reduces the amount of heat that the cooling coils must collect, thusreducing cooling costs. FIG. 6D depicts another embodiment in which aninformation technology enclosure 10 is raised by supports 68 so that afirst set of enthalpy wheels extends from an upper portion of shippingcontainer 20 and a second set of enthalpy wheels 64 extends from a lowerportion of shipping container 20. Supports 68 raise shipping container20 to allow access of enthalpy wheels 64 to external wind, although airmay also be pushed or pulled across enthalpy wheels 64 to remove somethermal energy before passing across cooling coils to remove additionalthermal energy so that the amount of thermal energy in the air isreduced before the air is exposed to the cooling coils.

Referring now to FIG. 7, a block diagram depicts an environmentcontroller 70 that applies information from multiple sensors to controlthe environment within a processing subsystem. Environmental controller70 is, for instance, a software module that resides on an informationhandling system running in an information technology enclosure, aprocessing subsystem or an infrastructure subsystem or a distantlocation interfaced through a network connection, such as an Internetconnection. Environmental controller 70 accepts inputs from externalsensors 74, internal sensors 75 and position sensors 76 to determineenvironmental conditions associated with information handling systemsunder its control, and manages the environmental conditions by commandsto controlled devices 78. External sensors 74 include ambient airtemperature sensors 80 to determine the temperature of the externalenvironment, relative humidity sensors 82 to determine the relativehumidity of the external environment and dew point sensors 84 todetermine the dew point of the external environment. Environmentcontroller 70 applies conditions sensed by external sensors 74 todetermine whether to operate in a closed loop or air economizationconfiguration. Internal sensors 75 sense conditions within aninformation technology enclosure, processing subsystem or infrastructuresubsystem. Information handling system temperature sensors 86 sense theoperating temperature of information handling systems, such as isprovided by internal sensors to the BIOS, baseboard managementcontroller (BMC) or other firmware operating on information handlingsystems and available through out-of-band network communications. Powerconsumption sensor 87 detects power consumed at the shipping container,such as for instances where power must be shut down, like during an overtemperature condition. Inlet side air temperature sensor 88 and inletside air pressure sensor 90 determine the temperature and pressure oftreated air that is fed into the information handling systems undercontrol. Airflow sensors 91 detect the air velocity through or near oneor more information handling systems. Exhaust side air temperaturesensor 92 and exhaust side air pressure sensor 94 determine thetemperature and pressure of air exhausted from the information handlingsystems under control. Cooling fluid input and output temperaturesensors senses the temperature of the cooling fluid before and aftercooling, such as near the point through which air is pushed before theair proceeds through the information handling systems.

Environmental controller 70 applies the information from externalsensors 74 and internal sensors 75 to determine appropriate actions forcontrolled devices 78. During closed loop operations, internal airrecycles within the information technology enclosure. Environmentcontroller 70 manages the operation of air movers 104, water supply 106and evaporator 110 to maintain internal environmental conditions withinpredetermined constraints. For example, measurements from informationhandling system temperature sensors 86 are compared against desiredmaximum and minimum levels to determine the amount and temperature ofair that is provided to each information handling system. In oneembodiment, a coil and air mover assembly including coils, air movers,motors, valves, control boards, variable frequency drives, sensors,humidity adders, controllable louvers/dampers and power, cooling fluid,and air signal inputs and outputs, interfaces with environmentalcontroller 70 so that environmental conditions are controlled to desiredconstraints. The amount and temperature of the input air is adjusted byaltering the speed at which air movers 104 operate and the temperatureof water supply 106. Adjustments are made to minimize energy consumptionof thermal control infrastructure. For instance, the amount of chilledwater provided by water supply 106 might be decreased by increasing theoperating speed of air movers 104, thus reducing energy consumption byexternal HVAC equipment. In some circumstances, energy consumed bythermal control infrastructure is reduced by transitioning to passivethermal management, such as air economization, which initiates thesupply of external air to the information technology enclosure 10 and/orthe exhausting of internal air from information technology enclosure 10.Environment controller 70 introduces external air with vent actuators108 that actuate vents to open positions as measured by vent positionsensor 98. In one embodiment, environmental controller 70 appliespassive thermal management by determining whether to deploy and operateentropy wheels. A filter sensor 100 determines the presence or absenceof a filter to determine whether external air flow is restricted.Whether operating in a closed loop mode or air economization mode,evaporator 110 is available to reduce humidity by running chilled waterthrough the evaporator and removing condensation or to aid humidity byproviding water for evaporation. An intrusion switch 102 detects openingof an access door so that environment controller 70 can alter operationsto optimize cooling with the access door open, such as by increasing thespeed of air movers 104.

Referring now to FIG. 8A, a front perspective view depicts aninformation technology enclosure 10 having an infrastructure subsystem12 and processing subsystem 11 in a stacked configuration. Each of theprocessing subsystem 11 and infrastructure subsystem 12 are built in aforty foot shipping container 20. Infrastructure subsystem 12 rests overtop processing subsystem 11 so that vents 46 in the floor ofinfrastructure subsystem 12 align with vents in the ceiling ofprocessing subsystem 11. A single row 18 of racks 16 support pluralinformation handling systems 22 to divide processing subsystem 11 alongthe length of shipping container 20 into an input portion 24 in thefront and an exhaust portion 26 in the rear. Information handlingsystems 22 pull air from the intake portion 24 and exhaust air to theexhaust portion 26. In the example embodiment of FIG. 8, racks 16provide 1296 U's of space with 24 full depth 54 U nineteen inch racks.Racks 16 hold up to 2408 server information handling systems 22, such as604 2 U chassis with switches, serial connectors and environmentmanagers. In the embodiment of FIG. 8, information handling systems 22are optimized for a predetermined function, such as a search enginefunction or a data storage function. By populating racks 16 withhomogeneous systems having a common function, infrastructure to supportoperations of the systems is more predictable and less expensive.

Infrastructure subsystem 12 has a coil and air mover assembly 40 whichblows treated air into intake portion 24 and receives exhaust fromexhaust portion 26. Coil and air mover assembly 40 may include any ofmultiple types of air movers, such as direct axial, plenum or impellerair movers. Coil and air mover assembly 40 relies on a source externalto shipping containers 20 for chilled water that cools air directed intointake portion 24. For example, a 100 ton air handling unit with airmover redundancy provides air to intake portion 24. In alternativeembodiments, multiple types of cooling techniques may be used to coolair moved into intake portion 24, such as chilled water, refrigerant orevaporation cooling. Uninterruptible power supply 44 in infrastructuresubsystem 12 include switches to manage power supply to manage powerapplication to infrastructure and information handling system elementsand to provide temporary power in the event of a power disruption. Atransformer, switch gear and metering module 44 operates on 480 Volts AC3-phase power and takes high voltage levels to step down for use bylower voltage components. A backup uninteruptable power supply isprovided with a battery 112 having a four minute life. Battery 112 has aheat pump 114 and heat pump exhaust 116 to maintain a proper operatingtemperature. Referring now to FIG. 8B, information handling systems 22are depicted in a rack 16 with supply air 118 and exhaust air 120.Chilled air from intake portion 24 provides supply air 118 which isforced through information handling systems 22 by internal cooling fansand an overpressure present at intake portion 24. Internal baffling 122prevents airflow between intake portion 24 and exhaust portion 26 exceptthrough information handling systems 22. In one embodiment, an end userorders processing and infrastructure modules built to order byspecifying the inclusion or exclusion of various elements in theprocessing and infrastructure enclosures. For example, an end user whoalready has resources for power step down, UPS or other elements, thoseelements might be removed from the infrastructure enclosure.

Although the present invention has been described in detail, it shouldbe understood that various changes, substitutions and alterations can bemade hereto without departing from the spirit and scope of the inventionas defined by the appended claims.

1. A system for processing information, the system comprising: ashipping container; plural information handling systems disposed in theshipping container and operable to process information, the informationhandling systems receiving cooling air at an inlet portion of theshipping container and exhausting air to an exhaust portion of theshipping container; an active thermal exchange device external to theshipping container and operable to actively remove thermal energy fromthe shipping container; a passive thermal exchange device operable topassively transfer thermal energy from the shipping container; and anenvironmental controller interfaced with the active thermal exchangedevice and the passive thermal exchange device, the environmentalcontroller operable to selectively engage the active and passive thermalexchange devices to maintain a desired thermal state in the shippingcontainer.
 2. The system of claim 1 wherein the active thermal exchangedevice comprises an air mover and a cooling coil, the air mover alignedto blow air past the cooling coil and into the intake portion of theshipping container.
 3. The system of claim 2 wherein the air mover andcooling coil are disposed in a second vertically stacked shippingcontainer.
 4. The system of claim 1 wherein the passive thermal exchangedevice comprises an enthalpy wheel disposed in the exhaust portion ofthe shipping container to passively remove thermal energy from airexhausted from the information handling systems.
 5. The system of claim1 wherein the passive thermal exchange device comprises an enthalpywheel disposed in a second shipping container, the second shippingcontainer in communication with the exhaust portion of the shippingcontainer having the information handling systems.
 6. The system ofclaim 1 wherein the passive thermal exchange device comprises anactuated vent interfaced with the environmental controller, the actuatedvent operable to move between an open position to allow external airinto the shipping container and a closed position to prevent externalair from entering the shipping container.
 7. The system of claim 6wherein the environmental controller moves the actuated vent from aclosed position to an open position if allowing external air into theshipping container reduces energy consumption of the active thermalexchange device.
 8. The system of claim 7 wherein the actuated ventdirects external air towards the air mover for treatment by the activethermal exchange device.
 9. The system of claim 7 wherein the actuatedvent directs external air to the intake portion of the shippingcontainer without treatment by the active thermal exchange device. 10.The system of claim 6 wherein the environmental controller moves theactuated vent from a closed position to an open position if allowing airto exit the exhaust portion of the shipping container external to theshipping container reduces energy consumption of the active thermalexchange device.
 11. A method for processing information, the methodcomprising: running plural information handling systems in a shippingcontainer, the information handling system receiving air from an intakeportion of the shipping container and exhausting air to an exhaustportion of the shipping container; providing an active thermal exchangedevice operable to actively remove thermal energy from the shippingcontainer; providing a passive thermal exchange device operable topassively remove thermal energy from the shipping container; andselectively engaging the active and passive thermal exchange devices tomaintain a desired thermal state in the shipping container with adesired energy consumption.
 12. The method of claim 11 wherein theactive thermal exchange device comprises an air mover and a cooling coiland wherein selectively engaging the active thermal exchange devicecomprises blowing air across the cooling coil and into the intakeportion.
 13. The method of claim 11 wherein providing a passive thermalexchange device comprises extending an entropy wheel into the exhaustportion of the shipping container.
 14. The method of claim 11 whereinproviding a passive thermal exchange device comprises providing anactuated vent and selectively engaging the passive thermal exchangedevice comprises opening the actuated vent to allow external air intothe intake portion.
 15. The method of claim 11 wherein providing apassive thermal exchange device comprises providing an actuated vent andselectively engaging the passive thermal exchange device comprisesopening the actuated vent to allow air to escape from the exhaustportion.
 16. The method of claim 11 wherein providing an active thermalexchange device further comprises: interfacing the shipping containerwith a second shipping container; disposing an air mover and a coilassembly in the second shipping container; providing chilled water tothe coil assembly from a source external to the second shippingcontainer; and blowing air with the air mover past the coil assembly andinto the intake portion.
 17. The method of claim 16 wherein providing apassive thermal exchange device further comprises: receiving exhaust airat the second shipping container from the exhaust portion; extending anenthalpy wheel into the received exhaust air to passively remove thermalenergy from the exhaust air; and directing the exhaust air to the airmover.
 18. The method of claim 16 wherein providing a passive thermalexchange device further comprises providing an actuated vent in thesecond shipping container, the actuated vent operable to move to an openposition to allow air external to the second shipping container toproceed to the air mover.
 19. The method of claim 18 wherein selectivelyengaging further comprises: removing chilled water from the coilassembly; and opening the actuated vent.